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Founded in 1972, Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, offering one of the largest package and test portfolios in the world. The company has three high-technology factories, all incorporating highly sophisticated, “state-of-the-art” equipment, ensuring products which meet the exacting quality standards set by the automotive, telecom, computer, and consumer electronics industries. Carsem factories maintain world-class quality standards. All factories have achieved IATF 16949, ISO 9001, ISO 14001, ANSI/ESD S20.20 certifications and comply with the Sony Green Partner Program.

  • Company: Carsem (M) Sdn Bhd
  • Year Established: 1972
  • Address: Jalan Lapangan Terbang, P.O. Box 204, 30720 Ipoh, Perak, Malaysia
  • Carsem (M) Sdn Bhd (S Site): Lot 52986, Taman Meru Industrial Estate, Jelapang, P.O. Box 380, 30020 Ipoh, Perak, Malaysia
  • Phone: +60 5312 3333 / +60 5526 2333
  • Fax: +60 5312 5333 / +60 5526 5333
  • Email: [email protected]
  • Website: carsem.com

Products:

  • Packaging (MLP; SIP; FCOL; MOCRO; POWER; Ect)
  • Testing
  • Other Technology Solutions (MLP Cu Clip: MLP Copper Clip; Cu WB: Copper Wire Bond; X3: Super Small X3 Package; SiP: System in Package; FCOL : Flip Chip on Leadframe; COL: Chip On Lead)

Location

Jalan Lapangan Terbang, P.O. Box 204, 30720 Ipoh, Perak, Malaysia