Contact
- Jalan Lapangan Terbang, P.O. Box 204, 30720 Ipoh, Perak, Malaysia
- [email protected]
- carsem.com
Founded in 1972, Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, offering one of the largest package and test portfolios in the world. The company has three high-technology factories, all incorporating highly sophisticated, “state-of-the-art” equipment, ensuring products which meet the exacting quality standards set by the automotive, telecom, computer, and consumer electronics industries. Carsem factories maintain world-class quality standards. All factories have achieved IATF 16949, ISO 9001, ISO 14001, ANSI/ESD S20.20 certifications and comply with the Sony Green Partner Program.
- Company: Carsem (M) Sdn Bhd
- Year Established: 1972
- Address: Jalan Lapangan Terbang, P.O. Box 204, 30720 Ipoh, Perak, Malaysia
- Carsem (M) Sdn Bhd (S Site): Lot 52986, Taman Meru Industrial Estate, Jelapang, P.O. Box 380, 30020 Ipoh, Perak, Malaysia
- Phone: +60 5312 3333 / +60 5526 2333
- Fax: +60 5312 5333 / +60 5526 5333
- Email: [email protected]
- Website: carsem.com
Products:
- Packaging (MLP; SIP; FCOL; MOCRO; POWER; Ect)
- Testing
- Other Technology Solutions (MLP Cu Clip: MLP Copper Clip; Cu WB: Copper Wire Bond; X3: Super Small X3 Package; SiP: System in Package; FCOL : Flip Chip on Leadframe; COL: Chip On Lead)